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Google TPU 五代技术演进:能效提升 30 倍
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本文提供了具体的能效提升倍数(30X)、规模扩张数据(256 至 9216)以及冷却/互连技术演变等细节,值得关注基础设施演进方向。核心解读
Google 的 TPU 团队发布了一篇关于从 TPU v2 到 Ironwood 五代芯片的演进分析论文,介绍了冷却从 air cooling 到 water cooling 的演变、interconnect 从 2D 到 3D torus 的升级,以及每代的规模提升(256 至 9216 个芯片)和能效提高 30 倍。论文还揭示了 Google 工作负载对 transformer 模型的日益依赖。
全文
My @Google colleagues @NormJouppi, Sridhar Lakshmanamurthy, Cliff Young, and David Patterson recently wrote a paper that will appear in the July/August 2026 edition of @ieeemicro titled "Google's Training Supercomputers from TPU v2 to Ironwood: Architectural Stability, Scale, Resilience, Power Efficiency, and Sustainability Across Five Generations". It's chock full of interesting data about the evolution of TPU chip generations, as well as how workloads at Google have transformed over time (hint: lots more transformer-based models!), and how the generations have gotten ~30X more energy efficient per flop.
Lots of changes over these generations:
Air cooling in TPUv2 to water cooling in TPUv3 onwards
2D to 3D torus-based interconnects
30X improvement TFLOPS/Watt
256 chips (TPUv2) to 9216 chips (Ironwood) per pod
Read the full paper: https://t.co/D5NFYFv19V



